Skip to content

mtd: spinand: Fix incorrect parameters for on-die ECC

Eberhard Stoll requested to merge feature/spinand-fix-on-die-ecc into develop-v5.10-stm32mp-ktn

The new generic NAND ECC framework stores the configuration and requirements in separate places since commit 93ef92f6 ("mtd: nand: Use the new generic ECC object"). In 5.10.x The SPI NAND layer still uses only the requirements to track the ECC properties. This mismatch leads to values of zero being used for ECC strength and step_size in the SPI NAND layer wherever nanddev_get_ecc_conf() is used and therefore breaks the SPI NAND on-die ECC support in 5.10.x.

By using nanddev_get_ecc_requirements() instead of nanddev_get_ecc_conf() for SPI NAND, we make sure that the correct parameters for the detected chip are used. In later versions (5.11.x) this is fixed anyway with the implementation of the SPI NAND on-die ECC engine.

Cc: stable@vger.kernel.org # 5.10.x Reported-by: voice INTER connect GmbH developer@voiceinterconnect.de Signed-off-by: Frieder Schrempf frieder.schrempf@kontron.de Acked-by: Miquel Raynal miquel.raynal@bootlin.com Signed-off-by: Greg Kroah-Hartman gregkh@linuxfoundation.org

Merge request reports